The use of PSLM combined with the PMP to achieve 100% high-precision solder paste 3D measurement in SMT production line. Using PSLM technology, changed the traditional way of generating 3D Struct Light, the traditional glass grating moire required mechanically, driven by a piezoelectric motor (PZT). By using PSLM, no need glass grating and mechanical parts any more. The elimination of the mechanical drive and moving parts, greatly improving the ease of use, and avoid mechanical wear and reduce maintenance costs.

System features 

Black anodized Aluminum extrusion with precision engineered tension & release

Tension method: mechanical 4-way multi_x005f point uniform springs tensioning with no foil distortion

Release Method: 4-Sided pneumatic system through silicon expansion bladder

Foil positioning method: Elongated slots around the four edges of the stencil foil

Compressed air: 4-5 bar

System features 

Black anodized Aluminum extrusion with precision engineered tension & release 

Tension method:  mechanical 4-way multi_x005f_x0002_point uniform springs tensioning with no foil distortion 

Release Method: 4-Sided pneumatic system through silicon expansion bladder 

Foil positioning method: Elongated slots around the four edges of the stencil foil 

Compressed air: 4-5 bar

The system mainly consits of micro focal X-ray source, image imaging unit, computer image processing system, mechanical system, electrical control system, safety protection system, warning system, including modern non-destructive tessolderg, computer software technology, image acquisition and processing technology, mechanical transmission technology as a whole, covering the optical, mechanical, electrical and digital image processing four categories of technology fields.

Robust Hardware — Ease of Use — Process Optimization

2 Year Warranty — 24 Hour World Class Customer Support

The system mainly consits of micro focal X-ray source, image imaging unit, computer image processing system, mechanical system, electrical control system, safety protection system, warning system, including modern non-destructive tessolderg, computer software technology, image acquisition and processing technology, mechanical transmission technology as a whole, covering the optical, mechanical, electrical and digital image processing four categories of technology fields.

The equipment is mainly composed of microfocus X-ray source, large area imaging unit, mechanical motion mechanism, electrical control system, image processing system, security protection system; Integrating modern nondestructive testing, computer software technology, image acquisition and processing technology, mechanical transmission technology into one system, covering four major technical fields of optical, electro-mechanical and digital image processing.

The equipment is mainly composed of microfocus X-ray source, large area imaging unit, mechanical motion mechanism, electrical control system, image processing system, security protection system; Integrating modern nondestructive testing, computer software technology, image acquisition and processing technology, mechanical transmission technology into one system, covering four major technical fields of optical, electro-mechanical and digital image processing.

Provides optimum productivity necessary for batch production by visibly improving three indicators of a chip mounter.

The DECAN series models can handle a wide range of components and maximize productivity with various PCB transfer systems.

The DECAN series models can handle a wide range of components and maximize productivity with various PCB transfer systems.

Special flux powder for wave-, selective-, hand-soldering

(WEEE/RoHS-conform)

[OSP-compatible]

ISO-9454: 2131 (2.1.3.A) / DIN-EN 61190-1-1: (IEC OR/L0)