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X-Ray use to examine internal solder joints, BGA, IC and other complex components. It adopts the structure of high resolution enhanced screen and sealed microcoking X ray tube combination, through X-ray non-destructive fluoroscopy, real-time observation of clear pictures.
The system mainly consits of micro focal X-ray source, image imaging unit, computer image processing system, mechanical system, electrical control system, safety protection system, warning system, including modern non-destructive tessolderg, computer software technology, image acquisition and processing technology, mechanical transmission technology as a whole, covering the optical, mechanical, electrical and digital image processing four categories of technology fields.
DetailsThe system mainly consits of micro focal X-ray source, image imaging unit, computer image processing system, mechanical system, electrical control system, safety protection system, warning system, including modern non-destructive tessolderg, computer software technology, image acquisition and processing technology, mechanical transmission technology as a whole, covering the optical, mechanical, electrical and digital image processing four categories of technology fields.
The system mainly consits of micro focal X-ray source, image imaging unit, computer image processing system, mechanical system, electrical control system, safety protection system, warning system, including modern non-destructive tessolderg, computer software technology, image acquisition and processing technology, mechanical transmission technology as a whole, covering the optical, mechanical, electrical and digital image processing four categories of technology fields.
DetailsThe system mainly consits of micro focal X-ray source, image imaging unit, computer image processing system, mechanical system, electrical control system, safety protection system, warning system, including modern non-destructive tessolderg, computer software technology, image acquisition and processing technology, mechanical transmission technology as a whole, covering the optical, mechanical, electrical and digital image processing four categories of technology fields.
The equipment is mainly composed of microfocus X-ray source, large area imaging unit, mechanical motion mechanism, electrical control system, image processing system, security protection system; Integrating modern nondestructive testing, computer software technology, image acquisition and processing technology, mechanical transmission technology into one system, covering four major technical fields of optical, electro-mechanical and digital image processing.
DetailsThe equipment is mainly composed of microfocus X-ray source, large area imaging unit, mechanical motion mechanism, electrical control system, image processing system, security protection system; Integrating modern nondestructive testing, computer software technology, image acquisition and processing technology, mechanical transmission technology into one system, covering four major technical fields of optical, electro-mechanical and digital image processing.
The equipment is mainly composed of microfocus X-ray source, large area imaging unit, mechanical motion mechanism, electrical control system, image processing system, security protection system; Integrating modern nondestructive testing, computer software technology, image acquisition and processing technology, mechanical transmission technology into one system, covering four major technical fields of optical, electro-mechanical and digital image processing.
DetailsThe equipment is mainly composed of microfocus X-ray source, large area imaging unit, mechanical motion mechanism, electrical control system, image processing system, security protection system; Integrating modern nondestructive testing, computer software technology, image acquisition and processing technology, mechanical transmission technology into one system, covering four major technical fields of optical, electro-mechanical and digital image processing.
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