TThis unit allows buffering of PCB's
in FIFO ,LIFO, Pass-through- mode. It uses belt segments
to hold the PCB over its complete lenght. When adding
or extracting a PCB to/from the buffer a drive mechanism
engages with the belt segment to smoothly
transfer the PCB in- or out.
The NG OK vertical buffer is designed to
buffer NG and OK board after inspection
machine (AOI / SPI) and pass a OK board
to next process.NG board will go to the
upper conveyor for visual check.
X,Y1,Y2,Z1,Z2 servo motor and driving system +U axis.
Lead screw and linear guide rail.
External lower noise vaccum cleaner.
High quality routing spindle.
Industrial PC and windows based English operation system.
Fiducial mark positioning, automatically correct coordinate offset.
Double workIing table, Max PCB size: 420*320mm *2pcs.
Overall Size: L1200mm×W1150mm×H1317mm(L*W*H).
500g/1000g Up two container can be loaded
Include balance block
LED Digital Display
High Reliability cutting system.
Top X axis PCB clamping system with bottom Y/Z axis cutting system, customized vacuum fixture on the clamper.
Max PCB size: 300*320mm.
Superb vision system.
Broken milling cutter detecting system.
External Industrial vacuum cleaner.
Full english software based on Win 7 or 10 OS.
Kavo/Sycotec Spindle, the machine has the function of automatic change the tool/router bit.
The turn conveyor is designed to change
the flow direction of a PCB assembly line.
The PCB is transferred onto the built-in
ESD belt conveyor, which turns either
clockwise or counter-clockwise.
This unit is used to invert / flip PCB's (180°)
for 'double-sided' process.
Panorama View Function Component
Monitoring before/after Plancement
Multi-Vendor Component Management
Function On-the-fly Placement Method
Easy Component Registration New Part
Editor The highest applicability to
long and large PCBs among machines of
the same class Mixed Use of Electric
Feeder and Pneumatic Feeder
The shuttle conveyor is used for
transporting boards from one line into two
lines or vice versa.The orientation of the board
is not changed during traversing.
Separates FPCs or PCBS with high
efficiency, Minimizing stress to boards,
components or solder joints, it can use
mutiple dies, dies replacement and
operation is very esay
Cuts within 1 mm of components
Low to moderate volume processing