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All Products In Category:   SoYi-R7/90 | SoYi-R9/100 | SoYi-C3 | SoYi-C2

X-Ray machine SoYi-R7/90

Quick Overview

The system mainly consits of micro focal X-ray source, image imaging unit, computer image processing system, mechanical system, electrical control system, safety protection system, warning system, including modern non-destructive tessolderg, computer software technology, image acquisition and processing technology, mechanical transmission technology as a whole, covering the optical, mechanical, electrical and digital image processing four categories of technology fields.

X-ray absorption differences by different materials, the internal structure of objects imaging and detection of internal defects, can be real-time observed products inspection image, determine whether the internal defects and defect types and grades, at the same time through the computer image processing system to complete the image storage and processing, in order to improve the image resolution, Ensure the accuracy of the assessment.

quality X-ray source in the world

Hardware

●   Top quality X-ray source in the world

●   Hamamatus 90KV Microfocus X-Ray source

 
HBI-Flat-panel-detector

Hardware

HBI Flat panel detector

●   HBI Flat detector has real-time image acquisition, real-time image correction, provides high quality image, passive cooling device, built-in temperature sensor can display the working temperature in real time, a variety of different gain gear PGA + Binning combined working modes.

●   0-60 degree tilting can detect the object in different angle.

 
Product loading platform

Hardware

Product loading platform

●   540*540mm big loading platform, platform rotating and tilting is optional.

 

X-Ray Detecing Theory

X-Ray Detecing Theory
 

Common defect-Electronic semiconductor

BGA soldering quality

BGA soldering quality

 
insufficient solder, bubble on lead

insufficient solder, bubble on lead

 
IC golden wire \ bubble detecting

IC golden wire \ bubble detecting

 
Solder height

Solder height

 
Soldering point bubble measuring

Soldering point bubble measuring

 
BGA bubble measuring

BGA bubble measuring

 
PCBA detecting

PCBA detecting

 
5G Base station circuit board detecting

5G Base station circuit board detecting

 
LED bubble detecting

LED bubble detecting

 
Chip bubble detecting

Chip bubble detecting

 
Chip bubble detecting

Chip bubble detecting

 
Common defect-Electronic semiconductor
 
Common defect-Electronic semiconductor
 
DIP soldering height detecting

DIP soldering height detecting

 
Component detecting

Component detecting

 
Common defect-Electronic semiconductor

SoYi-R7/ 90  Specification

Hardware

  X-Ray Source

  Type   Enclosed
  Volatge   90kV(200uA)
  Brand     Hamamatsu, made in Japan
  Spatial resolution   5um
  Imaging unit   Type   Flat panel detector
  Tilt angle   Single side 60° with flat panel
  Pixel matrix   1280*1024 pixel
  Pixel size   85um
  Frame rate   30ps
  System magnification   200X
  Brand   HBI, made in China

  Computer

  Industrial PC   Industrial PC, Window 10 system
  Display   23”

  Loading platform

  Loading area   540mm×540mm
  Detecting area (max)   510mm×510mm

  Software

  Software   Self-developed image processing system
  Auto measuring   BGA soldering voids auto measuring, support data /graphic output
  Multi measuring tools   Support measuring distance, angle, diameter, polygon, PTH filling rate, etc
  CNC mode   CNC programmable inspection, easy operation
  Real time display   Real time diplaying the working data of voltage, current, angle, date, etc

  Gerneral

  Power   2kW
  Size   1100*1360*1750mm(L*W*H), not including display and lighting tower
  Weight   950KG
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