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SMT equipments for all levels of production.
Capable to handle tape width 8mm.
Automatic detect component missing and tape hole pitch of 8mm tape with CCD.
Tape reel detecting with barcode scanning to prevent splicing wrong tape.
Capable to connect with MES system.
PC with touchscreen control, full English interface with Windows 10 OS.
Equipped with electric wheel, easy to drive the machine.
DetailsCapable to handle tape width 8mm.
Automatic detect component missing and tape hole pitch of 8mm tape with CCD.
Tape reel detecting with barcode scanning to prevent splicing wrong tape.
Capable to connect with MES system.
PC with touchscreen control, full English interface with Windows 10 OS.
Equipped with electric wheel, easy to drive the machine.
Provides optimum productivity necessary for batch production by visibly improving three indicators of a chip mounter.
Provides optimum productivity necessary for batch production by visibly improving three indicators of a chip mounter.
The DECAN series models can handle a wide range of components and maximize productivity with various PCB transfer systems.
The DECAN series models can handle a wide range of components and maximize productivity with various PCB transfer systems.
The DECAN series models can handle a wide range of components and maximize productivity with various PCB transfer systems.
DetailsThe DECAN series models can handle a wide range of components and maximize productivity with various PCB transfer systems.
Space-saving design with a width of 998mm.
This is applicalbe to the dual lane production.
An optimum production line can be configured for each production item through a combination of heads.
High productivity based on an original planet head and a structure of parallel two heads This is applicable to small-size IC components ranging from o3o15 chip to 25mm square to be placed.
DetailsSpace-saving design with a width of 998mm.
This is applicalbe to the dual lane production.
An optimum production line can be configured for each production item through a combination of heads.
High productivity based on an original planet head and a structure of parallel two heads This is applicable to small-size IC components ranging from o3o15 chip to 25mm square to be placed.
Chip component Placement speed 52,000 CPH(Optimum)※
Placement speed is increased by 24% compared with the exsiting model
Compact footpringt:the width is juts 1.25m
Wide range of components and boards:tall compoenets and large boards.
DetailsChip component Placement speed 52,000 CPH(Optimum)※
Placement speed is increased by 24% compared with the exsiting model
Compact footpringt:the width is juts 1.25m
Wide range of components and boards:tall compoenets and large boards.
23,300CPH chip (Laser centering/Optimum)
18,300CPH chip (Laser centering/ IPC9850)
One multi-nozzle laser head (6 nozzles)
From 0603(0201) to 33.5mm square components
Details23,300CPH chip (Laser centering/Optimum)
18,300CPH chip (Laser centering/ IPC9850)
One multi-nozzle laser head (6 nozzles)
From 0603(0201) to 33.5mm square components
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