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The system mainly consits of micro focal X-ray source, image imaging unit,computer image processing system, mechanical system, electrical control system, safety protection system, warning system, including modern non-destructive tessolderg, computer software technology, image acquisition and processing technology, mechanical transmission technology as a whole, covering the optical, mechanical, electrical and digital image processing four categories of technology fields.
X-ray absorption differences by different materials, the internal structure of objects imaging and detection of internal defects, can be real-time observed products inspection image, determine whether the internal defects and defect types and grades, at the same time through the computer image processing system to complete the image storage and processing, in order to improve the image resolution, Ensure the accuracy of the assessment.
| Quick login ● Quickly login software with fingerprint, no need to input password, improve work efficiency. ● Improve safety function. |
| Big loading platform ● 610mm*610mm loading area. ● 550mm*550mm detecting area. ● Mutiple product can be placed to improve efficiency. |
| 24”HD touch screen control panel ● 24 inch HD touch screen display, can be directly operated by hand on the display, makes operation convenient and fast. ● At the same time can cooperate with mouse, keyboard, joystick. |
| Safety radiation real-time monitoring function ● With real-time radiation detector, it can display real-time, average and cumulative radiation dose . ● Responsible for operator health while monitoring radiation dose. |
| Tilt function of the imaging system ● With the x-ray source tilt, 60 degrees of 2.5D detection is realized. ● Imaging tilt, no product tilt, to ensure that the product in the process of inspection will not be offset. |
| Electrical door ● In order to ensure the safety of radiation protection, even the weight of the front door is considerable. The front door adopts electric switch mode to reduce the work burden of the operator for a long time and avoid the premature damage of the door caused by the operation error. |
Common defect-Electronic semiconductor | |
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| IC golden wire、bubble detecting |
| Solder height |
| Soldering point bubble measuring |
| BGA bubble measuring |
| PCBA detecting |
| 5G Base station circuit board detecting |
| LED bubble detecting |
| Chip bubble detecting |
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RL-8200M X-Ray Detector Software | |
| Advanced features: ● Control mode: keyboard and mouse ,joystick to complete the whole detection. ● Standard graphics program processing function can be established, any operator with simple training can get the best X-ray image, with the center locking function of the measured point: when rotasolderg the detector, it can ensure that the observation point remains centered on the screen. ● With navigation function and CNC edisolderg function. ● The image has black and white automatic contrast function, edge sharpening and strengthening function. ● Bubble measurement function, can accurately measure the solder ball, chip bottom filling and other internal bubble proportion. ● False welding analysis through hole plug solder penetration measurement and other functions. ● BGA detection function, can automatically detect BGA short circuit, offset, solder bubble ratio, solder ball deformation, insufficient solder ball, missing, false welding and other defects. |
| Core technology :Imaging software ● X-RAYReal-time online image acquisition. ● Image enhancing technology. ● Image algorithm simulation. ● High speed defect locating and recognizing. |
RL-8200M X-Ray Detector Specification | |||
| Hardware | X-Ray source | Type | Enclosed |
| Voltage | 90kV(8W，160uA) | ||
| Imaging unit | Type | Flat panel detector | |
| Tilt angle | Single side 60° | ||
Computer | Industrial PC | Industrial PC | |
| Display | 24” | ||
Loading platform | Loading area | 610mm×610mm | |
| Detecsolderg area (max) | 550mm×550mm | ||
| Sample weight (max) | 8kg | ||
| Moving control | Joystick, mouse and keyboard | ||
Software | Software | Self-developed image processing system | |
| Auto setsolderg | Record coordinate and parameter of Character | ||
| Auto navigasolderg | Quickly move to detecsolderg point | ||
| Measuring | Capable to measure component bubble | ||
| Position edisolderg | Multi point detecsolderg | ||
| Whole machine | Weight | 1400kg | |
| Power supply | 220V 50Hz | ||
| Power | 2kW | ||
| Size | 1280(L)×1500(W)×1700(H)mm | ||
| Radiation leakage dose | <1μSv/h | ||
| Electrical door open | |||
| Fingerprint , password enter | |||
ILIKELEO
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sales@1clicksmt.com