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Small-angle 4-way projection system, further eliminates small spacing occlusion, breakthrough moire stripe algorithm, further reduces CT time.
| 3D Technology ● Small-angle 4-way projection system, further eliminates small spacing occlusion, breakthrough moire stripe algorithm, further reduces CT time. |
| Product Features ● Robust platform provides assurance for high-precision imaging. |
| Product Features ● Multi-angle light sources combined with high-resolution cameras and telecentric lenses greatly enhance detection results. |
| Product Features ● The latest self-developed AAM absolute accuracy measurement system accurately detects 01005 component solder joint defects. |
| Product Features ● Can be integrated with the MES system according to the needs of the factory. |
| Product Features ● Powerful SPC software provides rich and accurate data statistics. |
| Product Features ● High precision motion system ensures the walking and stopping accuracy under high-speed motion. |
| Software and hardware features ● Warpage compensation. |
| Software and hardware features ● High reflection suppression technology accurate detection of solder joint defects. |
| Software and hardware features ● Convenient and intuitive operating software. |
Al Detection System Architecture | |
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Defects detected by AI | |
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3D detection effect | |
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3D AOI System Specifications | ||
| Model | A3-510i | |
| PCB Inspection Parameter | Maximum board size (X x Y) | 510mm x 460mm |
| Mimimum board size (Y x X) | 50mm x 50mm | |
| PCB thickness | 0.6mm~6mm | |
| Board edge clearance | 3mm | |
| Top clearance | 25mm~40 mm adjustable | |
| Bottom clearance | 40mm | |
| 3D measuring height | 0-30mm | |
| Board weight | ≤3Kg | |
| Performance Parameter | Inspection parts | Chip: 03015 and above; LSI: 0.3mm pitch and above; others: odd-shaped parts |
| Inspection speed | ～450ms/Fov | |
| Inspection parts | Chip: 03015 and above; LSI: 0.3mm pitch and above; others: odd-shaped parts | |
| Soldering | No solder, less solder, more solder, bridging, false soldering, solder ball. | |
| Inspection parts | Chip: 03015 and above; LSI: 0.3mm pitch and above; others: odd-shaped parts | |
| Inspection speed | ～450ms/Fov | |
| Motion system | X/Y motion | AC servo motor |
| Rail adjustment | Auto+manual | |
| Conveying speed | 1500mm/s(Max) | |
| Conveying height | 900mm±20mm | |
| Conveying direction | Left to right \ Right to left \ Left to Left \ Right to Right (set befor shippment) | |
| Conveying method | Belt conveying | |
| Fixed rail | Front rail is fixed | |
| PCB clamping | Edge clamping | |
| Hardware | Operation system | Windows 10 |
| Communication | Ethernet, SMEMA | |
| Power supply | AC220V±10%, 50/60HZ, 1.8kVA | |
| Compressed air | 4~6Kg/cm2 | |
| Overall siz | L(1130mm) × W(1430mm) × H(1660mm) (not including lighting tower) | |
| Machine weight | Approximate 1200kg | |
| Environment temerature | 4℃~40℃ | |
| Humidity | 25～80% RH4 | |
| Vision system | Camera | 12M pixel CCD |
| Resolustion | 10μm | |
| FOV | 45*30mm(12MP,10μm) | |
| Lens | Telecentric lens | |
| Measuring method | Structured light grating*4 | |
| Lighting | 4 color lighting ring (RGBW) | |
ILIKELEO
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