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Solder paste thickness inspection BT-460 is mainly used to measure the thickness of solder layer on PCB. Its principle is that a very thin laser beam is emitted by the laser to illuminate the PCB at a certain Angle, and then the camera is used to observe the laser beam forming a thin line on PCB.Solder paste height and its bottom (PCB) will form a certain height difference, so that the laser line formed a certain break.The software calculates the height difference between the solder paste and the circuit board based on the laser break.
| The software interface is simple and easy to operate. |
| The software can calculate the CPK value through the measured value |
| Option:Y axis auto move to obtain the real solder paste thickness(the camre is 3million pixels) ,the 3D data model restructuring is more convenient to analysis. |
Benchtop solder paste thickness inspection BT-460 Features: |
1. Original German sharp color camera to gurantee the high accuracy and high stability of the test. |
2. With military grade secondary laser to reduce the interence of external environment light,more stable and longer service life. |
3. A flexible hardware design,adjustable light,laser and camera,can test derent colors of PCB. |
4. Softeare analysis conditions absed on the database,according to the analysis conditions to realize the early warning function,intuitive and easy to understand. |
5. Powerful reports analysis,automatically generate R-Chart and X-Bar,automatically calculate CPK. |
6. Export the complete and detail SPC report,compeletely avoid all sorts of disadvantages ofwritten reports. |
7. Software with simple and practical idea,forces on the test of high precision design,the repetitive accuracy of standard block reaches plus or minus 0.001mm. |
Benchtop solder paste thickness inspection BT-460 Specification | |
Model | BT-460 |
Tiptop measure precision | 0.001mm |
Repetive accuracy | ±0.003mm |
Lens magnification | 4X |
Optics inspection system | 1.3 million pixels |
Platform system | manual(option:Y axis auto) |
Measuring principle | No-touch laser bean |
Max meansure height | 1mm |
SPC software | Cpk,Cp,Xbar,R&S |
Computer system | Windows7 |
Power source | 1Ph,AC220V,50/60HZ |
Size | 460*500*350mm |
Weight | 25kg |
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