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Multi-functional placer SM482 PLUS

Quick Overview

The SM482PLUS can be applied to components from 0603 microchips to □22mm IC components by applying the on-the-fly recognition technology patented by Techwin, which enables component placement at the highest speed among all medium speed component placers. In addition, it can recognize components of □ 42mm with 0.4mm fine pith with a 45mm camera by applying a high pixel vision system to the stage camera. It also allows high precision (30 micron) placement of IC componets and provides a polygon recognition algorithm for easy registration of compnents of complicated shapes.

Powerful Vision Algorithm


Increases the recognition accuracy using the component image noise removal function 

and auto-teaching function. the flying camerahelps recognize and calibrate the components

 including Chip, TR, BGA, QFP, etc,while moving them to the placement position after pickup.

Automatic Real Time Pickup Position System 

Polygon Function

Abstracts and recognizes a component wholly

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Panorama View

For components whose size exceeds the FOV of a camera, the panorama view function that 

combines split component images into one is used. The soluton optimized for irregular 

shaped SMD components is provided by teaching the pickup/placement position easyly.

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Component Monitoring before/after Plancement


Checks for nozzle contamination during production to prevent non-insertion and 

dumping of a large number of components in advance, ensuring high quality production.

Time of inspection-Before/after ANC; before/after component placement;and 

after component dumping

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Multi-Vendor Component Management Function


When the same components are supplied from different component supply 

devices, this function allows components to be use without changing

 a PCB file and downloading a new PCB file.

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On-the-fly Placement Method

Owing to techwin's own On-the-fly image recognition technology which allows component recognition 

without stopping while moving after component pickup , placement speed is maximized by minimizing

 the moving time between the pickup position and placement position and reducing the recognition

 time to zero.


Added a new function maximizing the operational convenience of customers.

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Easy Component Registration New Part Editor


A Drag & Drop component registration system, allowing registration of component informatic

recognition and rotation by simply clicking the mouse. (When applying Elite2) In addition,

user convenience is further reinforced by unifying the on-line/off-line comvenience is further

reinforced by unifying the on-line/off-line component registration systems.

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Mixed Use of Electric Feeder and Pneumatic Feeder


Mixed use of electric and pneumatic feeders in the same feeder base is available for 

SM series component placers. The investment in production can be minimized by using 

these feeders along with existing feeders.

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The highest applicability to long and large PCBs among machines of the same class
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Features

NO.

Performance

Parameter  

1

  Placement Speed

Chip 30,000CPH(Optimal)

2

   Applicable Component

0402~□22(h12mm)(Flying) ~□55(h15mm)(Stage)

3

  Placement Accuracy

±40μm@±3σ/Chip ±30μm@±3σ/QFP

4

  Applicble PCB

L460×W400×1Lane (Standard) L1,200×W510×1Lane(Option)

SM482 PLUS Specification:

  Model

  SM482 PLUS  

  Alignment

  Flying Vision + Stage Vision

  Number of Spindles

  6 Spindes × 1 Gantry

  Placement Speed

  30,000CPH(Optimum)

  Placement Accuracy

  Chip   ±40μm@μ±3σ
  QFP     ±30μm@μ±3σ

  Component Range

  Flying Vision   0402(01005)~□14mm IC, Connector (Lead Pitch 0.4 mm) BGA,CSP (Ball pitch 0.65mm)
  0603(0201)~□22mm IC Connector(Lead pitch 0.5mm)~□ 17mm BGA, CSP(Ball pitch 0.75mm)
  Stage Vision     ~□32mm IC Connector(Lead Pitch 0.5mm)~□55mm(MFOV)
  ~□42mm IC,Connector(Lead Pitch 0.4mm) BGA,CSP(Ball pitch 1.0mm)~□55mm(MFOV)~75mm Connector
  Max.Height   15mm

   

  Min.   50(L)×40(W)
  Max.     Single Lane     460(L)×400(W) 510(L)×460(W)Option 610(L)×510(W)Option Max. 1,200(L)×510(W) Option
  Dual Lane     NA
  PCB Thickness   0.38~4.2

  Feeder Capacity (8mm standard)

 120ea/112ea(Dacking Cart)

  Utility

  Power   AC200/208/220/240/380/415V(50/60Hz, 3Phase)
  Max3..5kVA
  Air Consumption   180Ne/min  
  50Ne/min (vacuum pump)

  Mass(kg)

  Approx.1600

  External Dimension (mm)

  1650(L)×1680(D)×1530(H)

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