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All Products In Category:   SM481 PLUS | SM451 | SM482 PLUS | SM471 PLUS

Flexible placer SM481 PLUS

Quick Overview

The SM481PLUS can perform high-speed placement of chips at 40,000CPH and QFPs at one per 1.1 seconds, respectively (each at optimum speed ) by applying the on-the-fly recognition technology patented by techwin, which enables component placement at the highest speed among all medium speed component placers. with one-gantry structure having a high-speed piano head with 10 nozzles, the machine can be oerated with minimum manpower using one side of the machine. Being able to produce long boards with lengths of up to1,500mm, the machine boasts of its applicability to the largest PCBs among SM series component placers.

1,500mm long board


Two-staged placement using an extended conveyor allows production of long boards with 

lengths of up to 1,500mm.(The SM482PLUS can produce boards with lengths of up to 1,200mm)


One-Side Operation

With single gantry and single lane structures optimized for machine operation using only one 

side of the mchine, the production area and manpower can be utilized efficiently.


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Production speed and component coverage 

suitable for general-purpose high-speed placement


General-purpose high-speed machine among SM series component placers, 

which applies a high-speed piano head with 10 nozzles and an option for an upward camera.

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Panorama View Function


Since large-sized components are not viewed in one screen, it is hard to adjust 

their pickup or placement positions. In order to remove such inconvenience, 

the panorama view function is added to allow large components to be viewed

 within the FOV of a camera.

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Component Monitoring before/after Plancement


Checks for nozzle contamination during production to prevent non-insertion 

and dumping of a large number of components in advance, ensuring high 

quality production.Time of inspection-Before/after ANC; before/after 

component placement;and after component dumping

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Multi-Vendor Component Management Function


When the same components are supplied from different component 

supply devices, this function allows components to be use without

 changing a PCB file and downloading a new PCB file.

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On-the-fly Placement Method

Owing to techwin's own On-the-fly image recognition technology which allows component 

recognition without stopping while moving after component pickup , placement speed is

 maximized by minimizing the moving time between the pickup position and placement 

position and reducing the recognition time to zero.


Added a new function maximizing the operational convenience of customers.

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Easy Component Registration New Part Editor


A Drag & Drop component registration system, allowing registration of component

informatic recognition and rotation by simply clicking the mouse. (When applying Elite2) 

In addition, user convenience is further reinforced by unifying the on-line/off-line 

comvenience is further reinforced by unifying the on-line/off-line component registration systems.

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Mixed Use of Electric Feeder and Pneumatic Feeder


Mixed use of electric and pneumatic feeders in the same feeder base is available for SM 

series component placers. The investment in production can be minimized by using 

these feeders along with existing feeders.

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The highest applicability to long and large PCBs among machines of the same class
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Features

NO.

Performance

Parameter

1

  Placement Speed

Chip 40,000CPH(Optimal)

2

   Applicable Component

0402(01005inch)~ Max. □42mm(h15mm)

3

  Placement Accuracy

±40μm@±3σ/Chip ±30μm@±3σ/QFP

4

  Applicble PCB

L460×W400×1Lane (Standard) L1,500×W460×1Lane(Option)

SM481 PLUS Specification:

  Model

  SM481 PLUS  

  Alignment

  Flying Vision +Stage Vision(Option)

  Number of Spindles

  10 Spindes × 1 Gantry

  Placement Speed

  40,000 CPH (Optimum)

  Placement Accuracy

  Chip   ±40μm@μ±3σ
  QFP     ±30μm@μ±3σ

  Component Range

  Flying Vision   0402(01005)~□16mm IC Connector (Lead Pitch 0.4mm) BGA,CSP (Ball Pitch 4.0mm)
  NA
  Stage Vision     ~□ 16mm IC, Connector(Lead Pitch 0.3mm) BGA, CSP (Ball Pitch 0.4mm)~□ 32mm IC, Connector (Lead Pitch 0.4mm) BGA, CSP (Ball Pitch 0.5mm)
  ~□ 32mm IC,Connector(Lead Pitch 0.4mm)BGA, CSP (Ball Pitch 0.5mm)~□ 42mm (H12mm)IC, Connector (Lead Pitch 0.5mm) BGA, CSP (Ball Pitch 1.0mm)
  Max.Height   10mm(Option 15mm)

   

  Min.   50(L)×40(W)
  Max.     Single Lane     460(L×400(W) 510(L)×460(W)Option 610(L)×510(W)Option Max. 1,500(L)×460(W)(Option)
  Dual Lane     NA
  PCB Thickness   0.38~4.2

  Feeder Capacity (8mm standard)

 120ea/112ea(Dacking Cart)

  Utility

  Power   AC200/208/220/240/380/415V(50/60Hz, 3Phase)
  Max3..5kVA
  Air Consumption   0.5~0.7MPa(5.0~7.0kgf/cm²)
  150Ne/min  
  50Ne/min (vacuum pump)

  Mass(kg)

  Approx.1655

  External Dimension (mm)

  1650(L)×1680(D)×1530(H)

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