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Benchtop solder paste thickness inspection BT-460

Quick Overview

Solder paste thickness inspection BT-460 is mainly used to measure the thickness of solder layer on PCB. Its principle is that a very thin laser beam is emitted by the laser to illuminate the PCB at a certain Angle, and then the camera is used to observe the laser beam forming a thin line on PCB.Solder paste height and its bottom (PCB) will form a certain height difference, so that the laser line formed a certain break.The software calculates the height difference between the solder paste and the circuit board based on the laser break.

The software interface is simple and easy to operate.

The software interface is simple and easy to operate.

 

The software can calculate the CPK value through the measured value

The software can calculate the CPK value through the measured value

 

Option:Y axis auto move to obtain the real solder paste thickness(the camre is 3million pixels) ,the 3D data model restructuring is more convenient to analysis.

Option:Y axis auto move to obtain the real solder paste thickness(the camre is 3million pixels) ,the 3D data model restructuring is more convenient to analysis.

Benchtop solder paste thickness inspection BT-460 Features:

1. Original German sharp color camera to gurantee the high accuracy and high stability of the test.

2. With military grade secondary laser to reduce the interence of external environment light,more stable and longer service life.

3. A flexible hardware design,adjustable light,laser and camera,can test derent colors of PCB.

4. Softeare analysis conditions absed on the database,according to the analysis conditions to realize the early warning function,intuitive and easy to understand.

5. Powerful reports analysis,automatically generate R-Chart and X-Bar,automatically calculate CPK.

6. Export the complete and detail SPC report,compeletely avoid all sorts of disadvantages ofwritten reports.

7. Software with simple and practical idea,forces on the test of high precision design,the repetitive accuracy of standard block reaches plus or minus 0.001mm.

Benchtop solder paste thickness inspection BT-460 Specification

  Model

  BT-460

  Tiptop measure precision

  0.001mm

  Repetive accuracy

  ±0.003mm

  Lens magnification

  4X

  Optics inspection system

  1.3 million pixels

  Platform system

  manual(option:Y axis auto)

  Measuring principle  

  No-touch laser bean

  Max meansure height

  1mm

  SPC software

  Cpk,Cp,Xbar,R&S

  Computer system

  Windows7

  Power source

  1Ph,AC220V,50/60HZ

  Size

  460*500*350mm

  Weight

  25kg

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