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HB4-A4 Hot bar reflow soldering
system uses thermode technology
based on rapid reflow by pulse
heating to effectively bond flexible Board on PCB .
Hot Bar Reflow Soldering System HBS-A4 Applications
● Flex Circuit to PCB. |
● Ribbon Cable to PCB. |
● Coaxial Cables. |
● Fine Pitch SM Devices. |
● Edge Connectors to PCB. |
● Thermocompression Bonding. |
● Tab to PCB, HSC to LCD or tab. |
Hot Bar Reflow Soldering System HBS-A4 Features
● HB4-A4 Hot bar reflow soldering system uses thermode technology based on rapid reflow by pulse heating to effectively bond flexible Board on PCB. |
● Customized soldering head press all of the soldering joints of parts on PCB to solder it simultaneously by heating them to a temperature, it greatly improve soldering efficiency. |
● The heating up rate is adjustable to meet different requirement of application. |
● The heating up rate is adjustable to meet different requirement of application. |
● Molybdenum alloy head to ensure temperature stability, fast heating speed and long service life. |
● The level of soldering head is adjustable , to ensure that part assembly process is uniform. temperature, it greatly improve soldering efficiency. |
● Digital temperature controller with precise PID control ,ensure soldering quality. ● Optional CCD and display ,convenient for Quality check . |
HBS-A4 - Specifications | |
Model | HBS-A4 |
Work environment | 10-60℃ |
Work size | Max 150*150mm |
Temperature setting | RT ~ 500 ± 5 DEG C. |
Work pressure | 0.45-0.70Mpa |
Hot-pressing time | 1~99.9s adjustable |
power | AC220V±10% 50HZ,2300W |
Minimum soldering pitch | 0.2mm |
Soldering head size | MAX 60*5mm |
Machine Size | 460*480*560mm |
Machine weight | 60kg |
Option:
◎ Customized soldering head.
◎ CCD with display.
◎ Customized fixture.
ILIKELEO
Leopeng_keentec
sales@1clicksmt.com