● Both BGA chips and PCBs can be locally heated simultaneously; meanwhile, large-area infrared heaters can be used to pre-heat PCBs’ bottom sides. This way, deformation of PCB when being reworked can be avoided completely. You may choose to use only upper or lower temperature zone, and upper and lower heaters can be grouped freely.

● High-precision K-type thermocouple closed-loop controller and PID parameter self-tuning system are adopted. Seven temperature curves can be displayed and many pairs of parameters can be stored. U-disk can be used to copy and store tens of thousands of data sets. Instantaneous curve analysis can be performed. External temperature measuring interface is available to detect temperatures precisely. BGA temperature curves actually collected can be analyzed and checked anytime.

● High-precision and high-accuracy adjustable CCD color optical vision alignment system is adopted which allows you to perform beam split, amplification, diminution and fine tuning. It is also equipped with automatic color difference discrimination and brightness adjustment device to adjust image clarity. 15” high-definition LCD display is also available. Its high-degree automation prevents human from wrong operation completely. It has the best effect for reworking lead-free socket 775 as well as double-layer BGAs and other chips.

● High-definition touch-screen man-machine interface is adopted. This interface can be set as “Debug interface” and “Operate interface” to prevent wrong setting during operation. Both upper heating head and placement head are designed in an integrated way. Lead screw transmission system is used. Z-axis movement is driven by Panasonic servo controller system which can control both alignment points and heating points accurately. Suction and placement heights can be recognized automatically. Automatic soldering and de-soldering functions are available. Along with the passage of time after start-up, three temperature curves will be displayed on touch screen. Temperatures can be controlled with a precision of +/-1℃. Temperature, time, slope, cooling and alarm all are displayed on touch screen. It is equipped with a variety of titanium-alloy BGA nozzles which can be rotated by 360°and is easy to install and replace.

● Alignment system is controlled by joystick. Optical system can be moved forwards, backwards, leftwards and rightwards manually by joystick to observe in an all-round way how BGA chips’ four corners and central points are aligned, thus putting an end to “observation dead-angle”. X-axis, Y-axis and R-angle can be fine-tuned by micrometer. Its alignment precision is up to +/-0.01mm. It is also equipped with Cross-shaped infrared laser fast-positioning system and can be locked automatically after positioning.

● Multiple pairs of temperature settings can be stored and multiple sets of BGA chip heating points and alignment points can be stored. You may analyze, set and correct temperature parameters and curves any time on touch screen. Meanwhile, this machine does not need to rely on any external device (such as personal computer) but just uses its self-included USB port to download, print, save and analyze curves.

● V-shaped slot is used to position quickly, easily and accurately PCBs with different arrangement and size. Flexible and convenient universal fixture provides enough protection to PCBs to prevent chips along PCBs’ edges from damage and PCBs from deformation, thus ensuring success rate for reworking BGAs with various encapsulation sizes.

● Superior safety and protection: It is equipped with emergency stop switch and automatic power-off protector for abnormal accident. It is also equipped with titanium-alloy grid-guards to prevent hands from burning and objects from falling. After soldering or de-soldering is completed, alarm will be triggered. If temperature gets out of control, power will be cut off automatically, thus providing user with dual over-heat protection. Temperature parameters are protected with password to prevent any unauthorized modification. Also, other security protection and fool-proof function are provided to bring user superior security protection, ensuring reworked PCBs, components and rework station itself from being damaged by any abnormalities.

PCB Specification

PCB Size (Minimum)

8*8mm

PCB Size (Maximum Allowable)

615*480mm

PCB Size (Recommended Max.)

550*380mm

PCB Thickness

0.5mm-6mm

Component Specification

Component Size

MAX 60*60mm MIN2*2mm

Minimum BGA Ball pitch

0.3mm

Placement Precision

±0.01mm

Heating System

IR Bottom-heater

540*420mm(7200W)

Component heater (Top)

Hot Air 1200W

Component heater (Bottom)

Hot Air 1200W

Temperature Control

K-Type Thermocouple; Closed Loop PID

Machine Specification

Main Power Source

Single phase AC 380V 50/60Hz

Total Power Consumption

9700W

Machine Dimensions

L890*W940*H1000mm

Net Weight

140KG