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All Products In Category:   E-THERM HF Series | Power Oven Series | M6/M8 | E4/E6

Lead Free Reflow Oven HF Series

Quick Overview

1.Minimal down

2.Integrated residue management

3.User-friendly software tools for process monitoring

4.Modular system concept

5.Efficient heat transfer

6.Stable process for lead-free applications

7.Energy efficient system with lowest CO2 emission

8.Hightest process stability even with lead-free soldering

9.Excellent Traceablity due to smart software tools

10.Lowest Total Cost of Ownership

Lead Free Reflow Oven HF Series Advantages:

 Equipped with active cooling system of heat exchanger

●   Equipped with active cooling system of heat exchanger

 

Equipped with top cooling system actively

●   Equipped with top cooling system actively

 

Equipped with flux recovery system

●   Equipped with flux recovery system

 

Equipped with flux recovery system

●   Automatic refueling system and compatible with the SMEMA interface

 
Lead Free Reflow Oven HF Series Conveyor Module :

Monorail transition device transmission and switching

●   Monorail transition device transmission and switching

 

Guide to prevent deformation mechanism

●   Guide to prevent deformation mechanism

 
Lead Free Reflow Oven HF Series Conveyor Module :

 Single Conveyor    

50-400mm (Standard Transport PCB Size, without CBS)

50-600mm(Option) without CBS

Single Conveyor
 

  Dual Conveyor (option)

   50-300mm (without CBS)

◆   Symmetric width adjustment

◆   Synchronous /asynchronous conveyor speed

Dual Conveyor (option)
Lead Free Reflow Oven HF Series Preheating Module :

●   Each product has its own requirements in the manufacturing process. Optimized heat transfer over the entire soldering process is the basis for best possible results.

●   HF series offers flexibly controllable preheating zones within which your PCB is preheated and prepared for the actual soldering process. The individual zones can be controlled independently of each other via fan frequency ,and assure best possible process.

●   HF is equipped with special nozzle sheets for optimized heat transfer by means of uniform air flow over the PCBs. Flow speeds in the upper and lower heat zones can be separately controlled , assuring that your is heated up through and through-completely and uniformly. This prevents stressing of the material which can disturb the soldering process. In addition, smaller components are not overheated and bigger ones are still heated through enough.

●   To ensure that the heat flow in the system runs stably and the outward heat radiation is as low as possible, our HF systems have optimum insulation between the process chamber and the exterior wall.

●   Using precise profiling we can generate precision-reproducible temperature profile which are tailored to component size, material or process parameters.

 

  Convection

The centerpiece is the stainless steel process chamber with its outstanding heat transfer owing to advanced hole nozzle geometry as well as monitored adjustable overpressure in the heating module , guaranteeing homogeneous and gapless heat transfer to the circuit board. The inert process atmosphere can be assured-throughout the entire soldering process and beyond because the closed system ensures that no external air finds its way into process chamber. The heat flow within the system takes place by means of circulation, the process hot air of the preheating , peak and cooling zones is extracted, cleaned and reinserted into the process at the sides

 

Features

  Features  

●   Separately adjustable heating zone

●   Reproducible temperature profile

●   Homogenous heat input over the entire PCB thanks to specially designed nozzles

●   Low maintenance effort

 

Saddle Profile

  Saddle Profile

●   The component is brought to a temperature of at least 240C for soldering .Using a saddle profile ,PCB is gradually heated inline with pre-defined, individual temperature ranges. Even components with differing thermal masses are heated homogeneously and temperature difference

 

Linear Profile

  Linear Profile

●   With a linear profile, the component is not heated in a stepped manner during soldering , in fact it is heated along an identical linear temperature gradient. Linear profiles can reduce cycle times and can help to reduce soldering errors such as tombstoning

Lead Free Reflow Oven HF Series Features:

●   Minimal down
●   Integrated residue management

●   User-friendly software tools for process monitoring

●   Modular system concept

●   Efficient heat transfer

●   Stable process for lead-free applications  
●   Energy efficient system with lowest CO2 emission

●   Hightest process stability even with lead-free soldering

●   Excellent Traceablity due to smart software tools

●   Lowest Total Cost of Ownership

 HF Lead Free Reflow Oven Machine - Specification

  Model

  HF-8A

  HF-10A

  HF-12A

  General Data

 

  Dimension

  L5900*W1300*H1500

  L6700*W1300*H1500

  L7530*W1300*H1500

  Net weight

  Around 2200Kg

  about 2300Kg

  about 2400Kg

  Startup Time

3PH 380V 50HZ

  Starting Power

  36KW

  36KW

  40KW

  Power Supply

Approx.20-25 Min

  Power consumption

  Approx.8-10KW

  Approx.9-11KW

  Approx.10-12KW

  Exhaust Value

10-12m3/min

  Preheating Zone Flux Recovery

Yes

  Cooling Zone Flux Recovery

  Yes

  Preheat Heating

 

  Heating Zones

  Upper 8/ Bottom 8

  Upper 10/ Bottom 10

  Upper 12/ Bottom 12

  Tunnel Length

  3400mm

  4240mm

  5080mm

  Setting Temp Range

  Room Temp-300C

  Room Temp-300C

  Room Temp-300C

  Max. Temp Setting Between Preheat & Welding Zone

  80°

  Max. Temp Setting Between Each Preheat Zone  

  40°

  Max. Temp Setting Between Each Welding Zone

  40°

  Temp Control Accuracy

  +/-1

  Overtemperature Protection

   Yes

  Adjustment Range of Air Blower Motor  

  1680-2800RMP

  Cooling System

 

  Number of Cooling Zone

  3

  Length of Cooling Zone

  1014mm

  Cooling Mode

  Air Cooling

  Chiller  

  NO

  Conveyor

 

  Upper Clearance

  30mm

  Bottom Clearance

  25mm

  Transport Width

  50-400mm

  Transport Speed  

  200-2000 mm/min

  Transport Height

  900+/-20mm

  Conveyor Type

  Mesh Belt + Pin Chian

  Transport Direction

  L-R/R-L

  Conveyor Width Adjustment  

  Manual/Electric

  Central Support System

  Option

  Pin Chian Lubrication

  Automatic

  Control System

 

  Automatic Power Off

  Yes

  Operation System  

  Win 7

  Controlling type

  PC + SIEMENS PLC controlling

  UPS

  Yes

 

 HF Lead Free Reflow Oven Machine - Specification

  Model

  HF-8N

  HF-8N

  HF-12N

  General Data

 

  Dimension

  L5900*W1300*H1500

  L6700*W1300*H1500

  L7530*W1300*H1500

  Net weight

  Around 2400Kg

  about 2500Kg

  about 2600Kg

  Power Supply  

3PH 380V 50HZ

  Starting Power

  40KW

  42KW

  45KW

  Startup Time

Approx.20-25 Min

  Power consumption

  Approx.8-10KW

  Approx.9-11KW

  Approx.10-12KW

  Exhaust Value

10-12m3/min   2PCS  

  Preheating Zone Flux Recovery

Yes

  Cooling Zone Flux Recovery

  Yes

  Preheat Heating

 

  Heating Zones

  Upper 8/ Bottom 8

  Upper 10/ Bottom 10

  Upper 12/ Bottom 12

  Tunnel Length

  3400mm

  4240mm

  5080mm

  Setting Temp Range

  Room Temp-300C

  Room Temp-300C

  Room Temp-300C

  Max. Temp Setting Between Preheat & Welding Zone

  80°

  Max. Temp Setting Between Each Preheat Zone  

  40°

  Max. Temp Setting Between Each Welding Zone

  40°

  Temp Control Accuracy

  +/-1

  Overtemperature Protection

   Yes

  Adjustment Range of Air Blower Motor  

  1680-2800RMP

  Cooling System

 

  Number of Cooling Zone

  3

  Length of Cooling Zone

  1014mm

  Cooling Mode

  Chiller

  Conveyor

 

  Upper Clearance

  30mm

  Bottom Clearance

  25mm

  Transport Width

  50-400mm

  Transport Speed  

  200-2000 mm/min

  Transport Height

  900+/-20mm

  Conveyor Type

  Mesh Belt + Pin Chian

  Transport Direction

  L-R/R-L

  Conveyor Width Adjustment  

  Manual/Electric

  Central Support System

  Option

  Pin Chian Lubrication

  Automatic

  Control System

 

  Automatic Power Off

  Yes

  Operation System  

  Win 7

  Controlling type

  PC + SIEMENS PLC controlling

  UPS

  Yes

  Nitrogen System

  Heating & Cooling Zone Nitrogen System

  Yes

  Nitrogen Protection System (exit port)

  Yes

  Oxygen Analyzer  

  Yes

  Nitrogen PID Automatic Adjustment

  Option

  Nitrogen Consumption  

  1500PPM  /18m3/H

Lead Free Reflow Oven RR Series Includes:

●   Lead Free Reflow Oven
●   Industrial PC control system

●   Automatic lubricating design by pressure pump

●   Flux Recovery system

●   Cooling system

●   1 year warranty

●   Free Accessories

Lead Free Reflow Oven HF Series Flux Recovery Module :

 Liquid residue in the cooling area in condensing unit filter first, then expelled, filter unit is easy to clean.

●   Liquid residue in the cooling area in condensing unit filter first, then expelled, filter unit is easy to clean.

 

Equipped with gateway rosin recovery system

●   Equipped with gateway rosin recovery system

 

Through three rosin filtration system, significantly improve the system efficiency of cleaning, keep clean, dry chamber of a stove or furnace, at the same time minimizing maintenance requirements and downtime

●   Through three rosin filtration system, significantly improve the system efficiency of cleaning, keep clean, dry chamber of a stove or furnace, at the same time minimizing maintenance requirements and downtime

 
Lead Free Reflow Oven HF Series Flux Recovery Module :

Effective Residue Management

●   The same as all industrial processes, substances are generated during SMT production which have to be removed from the process cycle because they contaminate the system. Our highly effective residue management function purifies the process air safely and reliably ,and keeps your system clean and dry

●   In order to make your manufacturing system even more efficient, your system’s cleaning efficiency is significantly increased. For the process air and the system chambers will keep clean and dry with very little maintenance and minimal downtime


Lead Free Reflow Oven HF Series Cooling Module :

Powerful Cooling System

●   It is important to have a high-performance cooling tract in order to guarantee optimum soldering results and ensure that modules are cooled gently

●   We offers a wide range of cooling tract variants for reflow convection soldering, which can be precisely fine-tuned to suit any production process. The water-cooled standard solution with heat exchanger and adjustable ventilation system works as an effective “closed loop” system, realize the high efficiency cooling

●   Stress-free cooling using individually adjustable ventilators in the classic cooling zones

●   Flexible combination possibilities through a range of different options

Lead Free Reflow Oven HF Series Control System:

Electric: PC+ PLC control to ensure the equipment running stable

Software:

●   Windows operation interface, support 2000/XP/win7 operation system

●   Support language switching between English &  Traditional/Simplified Chinese

●   User Friendly interface

●   Perfect temperature profile analysis, storage and invoking function

●   Stable Different level of password , operating records
●   Real time display the running parameters

●   Built-in welding defect analysis manual

●   Built-in maintenance manual

Lead Free Reflow Oven HF Series Options:
Guide rail + central support transmission without mesh beltDual transmission
  Guide rail + central support transmission without mesh belt    Dual transmission
Nitrogen control system

●   Nitrogen Consumption:≤18m3/hour

●   Min Oxygen concentration :≤1500PPM

Oxygen system layoutOxygen concentration monitoring curve cover alloxygen  analyzer

Oxygen system layout

Oxygen concentration monitoring curve  cover all

oxygen  analyzer

 

Water chiller cooling system


Water chiller cooling system

It is an option for HF-8A series hot air reflow oven

For HF-8N Nitrogen reflow oven, it is standard configuration

Our Customers
Our Customers

 

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